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Description
TAFMER™ DF640The TAFMER DF of ethylene based copolymers is used to lower Heat Seal Initiation Temperature (HSIT) General characteristics attributed to TAFMER: Low Melting Point for lowering Heat Seal Initiation Temperature (HSIT) Low Youngs Modulus for Softness and Flexibility Low Crystallinity for Transparency Low Glass Transition Temperature for Low Temperature Impact Resistance Miscible with PE and Compatible with PP for Adhesion Strength Control In PE blown
The TAFMER™ DF of ethylene based copolymers is used to lower Heat Seal Initiation Temperature (HSIT)
General characteristics attributed to TAFMER™:
• Low Melting Point for lowering Heat Seal Initiation Temperature (HSIT)
• Low Young’s Modulus for Softness and Flexibility
• Low Crystallinity for Transparency
• Low Glass Transition Temperature for Low Temperature Impact Resistance
• Miscible with PE and Compatible with PP for Adhesion Strength Control
In PE blown film, it is used to lower HSIT, improve transparency and adhesion strength to PP.
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